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EPF6010AFC256-1

Intel
RoHS
/
Package 256-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description FLEX 6000 256-BGA TIN LEAD Surface Mount field programmable gate array 17mm 3.3V 172MHz 1.7ns
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Technical Details

Compliance

RoHS Status Non-RoHS Compliant

Dimensions

Width 17mm
Length 17mm

Technical

Number of CLBs 880
Combinatorial Delay of a CLB-Max 1.7 ns
Number of LABs/CLBs 88
Number of Gates 10000
Number of Logic Elements/Cells 880
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Clock Frequency 172MHz
Number of I/O 171
Qualification Status Not Qualified
JESD-30 Code S-PBGA-B256
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Reach Compliance Code compliant
Terminal Pitch 1mm
Supply Voltage 3.3V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
Voltage - Supply 3V~3.6V
HTS Code 8542.39.00.01
Terminal Finish TIN LEAD
Number of Terminations 256
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Obsolete
JESD-609 Code e0
Series FLEX 6000
Packaging Tray
Operating Temperature 0°C~85°C TJ

Physical

Surface Mount YES
Package / Case 256-BGA
Mounting Type Surface Mount

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