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EPF10K30EFI256-3

Intel
RoHS
/
Package 256-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description MIXED CMOS Non-RoHS Compliant BALL field programmable gate array -40C~85C TA 12.5ns 2.52.5/3.3V 2.1mm
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Technical Details

Physical

Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES

Technical

Operating Temperature -40°C~85°C TA
Packaging Tray
Series FLEX-10KE?
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 2.375V~2.625V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 2.5V
Terminal Pitch 1mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B256
Number of Outputs 176
Qualification Status Not Qualified
Power Supplies 2.52.5/3.3V
Number of I/O 176
Propagation Delay 12.5 ns
Number of Inputs 176
Programmable Logic Type LOADABLE PLD
Number of Logic Elements/Cells 1728
Total RAM Bits 24576
Number of Gates 119000
Number of LABs/CLBs 216
Output Function MIXED

Dimensions

Height Seated (Max) 2.1mm
Length 17mm
Width 17mm

Compliance

RoHS Status Non-RoHS Compliant

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