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EPF10K200EBI600-2

Intel
RoHS
/
Package 600-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description FLEX-10KE? EPF10K200 600-BGA Tin/Lead (Sn/Pb) field programmable gate array 1.93mm 2.52.5/3.3V 140MHz 0.6ns
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Technical Details

Physical

Mounting Type Surface Mount
Package / Case 600-BGA
Surface Mount YES

Technical

Operating Temperature -40°C~85°C TA
Packaging Tray
Series FLEX-10KE?
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 600
ECCN Code 3A991
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 2.3V~2.7V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 2.5V
Terminal Pitch 1.27mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPF10K200
JESD-30 Code S-PBGA-B600
Number of Outputs 470
Qualification Status Not Qualified
Power Supplies 2.52.5/3.3V
Number of I/O 470
Clock Frequency 140MHz
Propagation Delay 0.6 ns
Number of Inputs 470
Programmable Logic Type LOADABLE PLD
Number of Logic Elements/Cells 9984
Total RAM Bits 98304
Number of Gates 513000
Number of LABs/CLBs 1248
Output Function MIXED

Dimensions

Height Seated (Max) 1.93mm
Length 45mm
Width 45mm

Compliance

RoHS Status Non-RoHS Compliant

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