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EPF10K130EBC600-2X

Intel
RoHS
/
Package 600-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description MIXED CMOS Non-RoHS Compliant BALL FPGA 0C~70C TA 0.5ns 2.52.5/3.3V 1.93mm
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Technical Details

Compliance

RoHS Status Non-RoHS Compliant

Dimensions

Width 45mm
Length 45mm
Height Seated (Max) 1.93mm

Technical

Output Function MIXED
Number of LABs/CLBs 832
Number of Gates 342000
Total RAM Bits 65536
Number of Logic Elements/Cells 6656
Programmable Logic Type LOADABLE PLD
Number of Inputs 424
Propagation Delay 0.5 ns
Number of I/O 424
Power Supplies 2.52.5/3.3V
Qualification Status Not Qualified
Number of Outputs 424
JESD-30 Code S-PBGA-B600
Base Part Number EPF10K130
Time@Peak Reflow Temperature-Max (s) 30
Reach Compliance Code compliant
Terminal Pitch 1.27mm
Supply Voltage 2.5V
Peak Reflow Temperature (Cel) 220
Terminal Form BALL
Terminal Position BOTTOM
Voltage - Supply 2.375V~2.625V
Technology CMOS
Subcategory Field Programmable Gate Arrays
HTS Code 8542.39.00.01
Terminal Finish Tin/Lead (Sn/Pb)
ECCN Code 3A991
Number of Terminations 600
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Obsolete
JESD-609 Code e0
Series FLEX-10KE?
Packaging Tray
Operating Temperature 0°C~70°C TA

Physical

Surface Mount YES
Package / Case 600-BGA
Mounting Type Surface Mount

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