EP2AGX45DF25I3
RoHS
/
Package 572-BGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
IC FPGA 252 I/O 572FBGA
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Technical Details
Physical
Mounting Type Surface Mount
Package / Case 572-BGA, FCBGA
Technical
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria II GX
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish TIN LEAD
Voltage - Supply 0.87V~0.93V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number EP2AGX45
Number of I/O 252
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 42959
Total RAM Bits 3517440
Number of LABs/CLBs 1805
Compliance
RoHS Status Non-RoHS Compliant
Alternative Model
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