EPF10K130EFC484-2X
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
Contains Lead MIXED CMOS COMMERCIAL FPGA 85C 10mA 4kB 0.5ns
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Technical Details
Physical
Mount Surface Mount
Package / Case BGA
Number of Pins 484
Technical
Packaging Bulk
Published 1998
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 484
ECCN Code 3A991
Terminal Finish Tin/Lead (Sn/Pb)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 484
Number of Outputs 369
Qualification Status Not Qualified
Operating Supply Voltage 2.5V
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 2.52.5/3.3V
Temperature Grade COMMERCIAL
Memory Size 4kB
Operating Supply Current 10mA
Number of I/O 369
RAM Size 8kB
Propagation Delay 0.5 ns
Programmable Logic Type LOADABLE PLD
Number of Logic Elements/Cells 6656
Number of Gates 342000
Number of Logic Blocks (LABs) 832
Output Function MIXED
Dimensions
Height Seated (Max) 2.1mm
Length 23mm
Width 23mm
Compliance
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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