EP4SGX360HF35I3N
RoHS
/
Package FBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
CMOS 2008 RoHS Compliant BALL FPGA 100C 2.8MB 600MHz 930mV
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Technical Details
Supply Chain
Factory Lead Time 10 Weeks
Physical
Mount Surface Mount
Package / Case FBGA
Number of Pins 1152
Technical
Published 2008
JESD-609 Code e1
Pbfree Code yes
Moisture Sensitivity Level (MSL) 4
ECCN Code 3A001.A.7.A
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 0.9V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Number of Outputs 564
Qualification Status Not Qualified
Operating Supply Voltage 900mV
Power Supplies 0.91.2/31.52.5V
Max Supply Voltage 930mV
Min Supply Voltage 870mV
Memory Size 2.8MB
Number of I/O 564
RAM Size 2.8MB
Frequency (Max) 600MHz
Data Rate 600 Mbps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 353600
Number of Logic Blocks (LABs) 14144
Number of Transceivers 24
Dimensions
Height Seated (Max) 3.6mm
Length 35mm
Width 35mm
Compliance
RoHS Status RoHS Compliant
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