EP4SGX230DF29I4
RoHS
/
Package FBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
CMOS 2008 Non-RoHS Compliant BALL FPGA 100C 2.1MB 600MHz 900mV
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Technical Details
Supply Chain
Factory Lead Time 8 Weeks
Physical
Mount Surface Mount
Package / Case FBGA
Number of Pins 780
Technical
Published 2008
JESD-609 Code e0
Pbfree Code no
Moisture Sensitivity Level (MSL) 4
Number of Terminations 780
ECCN Code 3A001.A.7.A
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 0.9V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 780
Number of Outputs 372
Qualification Status Not Qualified
Operating Supply Voltage 900mV
Supply Voltage-Max (Vsup) 0.93V
Power Supplies 0.91.2/31.52.5V
Memory Size 2.1MB
Number of I/O 372
RAM Size 2.1MB
Frequency (Max) 600MHz
Data Rate 600 Mbps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 228000
Number of Logic Blocks (LABs) 9120
Number of Transceivers 8
Dimensions
Height Seated (Max) 3.5mm
Length 29mm
Width 29mm
Compliance
RoHS Status Non-RoHS Compliant
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