EP4CE75F23C8L
RoHS
/
Package FBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
OTHER 2003 RoHS Compliant BALL FPGA 85C 343.1kB 200MHz 0.97V
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Technical Details
Supply Chain
Factory Lead Time 12 Weeks
Physical
Mount Surface Mount
Package / Case FBGA
Number of Pins 484
Technical
Published 2003
JESD-609 Code e0
Pbfree Code no
Moisture Sensitivity Level (MSL) 3
Number of Terminations 484
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 484
Number of Outputs 295
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.03V
Power Supplies 11.2/3.32.5V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 0.97V
Memory Size 343.1kB
Number of I/O 292
RAM Size 343.1kB
Frequency (Max) 200MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 75408
Number of Logic Blocks (LABs) 4713
Dimensions
Height Seated (Max) 2.4mm
Length 23mm
Width 23mm
Compliance
RoHS Status RoHS Compliant
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