EP4CE55F29C9LN
RoHS
/
Package FBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
OTHER 2003 RoHS Compliant BALL FPGA 85C 292.5kB 200MHz 1.2V
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Technical Details
Supply Chain
Factory Lead Time 10 Weeks
Physical
Mount Surface Mount
Package / Case FBGA
Number of Pins 780
Technical
Published 2003
JESD-609 Code e1
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3
Number of Terminations 780
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 780
Number of Outputs 377
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Supply Voltage-Max (Vsup) 1.03V
Power Supplies 11.2/3.32.5V
Temperature Grade OTHER
Memory Size 292.5kB
Number of I/O 374
RAM Size 292.5kB
Frequency (Max) 200MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 55856
Number of Logic Blocks (LABs) 3491
Dimensions
Height Seated (Max) 2.4mm
Length 29mm
Width 29mm
Compliance
RoHS Status RoHS Compliant
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