EP1K10FI256-2
RoHS
/
Package FBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
Contains Lead MIXED CMOS INDUSTRIAL FPGA 85C 5mA 1.5kB 0.5ns
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Technical Details
Physical
Mount Surface Mount
Package / Case FBGA
Number of Pins 256
Technical
Packaging Bulk
Published 2000
JESD-609 Code e0
Pbfree Code no
Moisture Sensitivity Level (MSL) 3
Number of Terminations 256
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 2.5V
Terminal Pitch 1mm
Frequency 200MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 256
Number of Outputs 136
Operating Supply Voltage 2.5V
Temperature Grade INDUSTRIAL
Max Supply Voltage 2.625V
Min Supply Voltage 2.375V
Memory Size 1.5kB
Operating Supply Current 5mA
Number of I/O 136
RAM Size 1.5kB
Propagation Delay 0.5 ns
Frequency (Max) 80MHz
Programmable Logic Type LOADABLE PLD
Number of Logic Elements/Cells 576
Number of Gates 56000
Number of Logic Blocks (LABs) 72
Speed Grade 2
Output Function MIXED
Number of Logic Cells 576
Dimensions
Length 17mm
Width 17mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Contains Lead
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