EP1AGX50DF1152I6N
RoHS
/
Package FBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
INDUSTRIAL 2007 RoHS Compliant BALL FPGA 100C 500mA 302.1kB 622.08MHz
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Technical Details
Supply Chain
Factory Lead Time 12 Weeks
Physical
Mount Surface Mount
Package / Case FBGA
Number of Pins 1152
Technical
Published 2007
JESD-609 Code e1
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3
ECCN Code 3A001.A.7.A
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Subcategory Field Programmable Gate Arrays
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Number of Outputs 350
Operating Supply Voltage 1.2V
Power Supplies 1.22.5/3.3V
Temperature Grade INDUSTRIAL
Max Supply Voltage 1.25V
Min Supply Voltage 1.15V
Memory Size 302.1kB
Operating Supply Current 500mA
Number of I/O 514
RAM Size 302.1kB
Frequency (Max) 622.08MHz
Data Rate 600 Mbps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 50160
Number of Logic Blocks (LABs) 2508
Number of Transceivers 8
Dimensions
Height Seated (Max) 3.5mm
Length 35mm
Width 35mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
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