5ASXMB3E4F31C4N
RoHS
/
Package FBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
ARM OTHER DMA POR WDT 2013 FPGA 85C 18.8MB 925MHz 1.13V
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Technical Details
Compliance
RoHS Status RoHS Compliant
Dimensions
Width 31mm
Length 31mm
Height Seated (Max) 2.7mm
Technical
Number of Transceivers 12
Number of Logic Blocks (LABs) 132075
Core Architecture ARM
Number of Logic Elements/Cells 350000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Data Rate 6.375 Gbps
Peripherals DMA, POR, WDT
RAM Size 2.4MB
Number of I/O 170
Memory Size 18.8MB
Interface EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Temperature Grade OTHER
Supply Voltage-Max (Vsup) 1.13V
Operating Supply Voltage 1.1V
JESD-30 Code S-PBGA-B896
Pin Count 896
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Frequency 925MHz
Terminal Pitch 1mm
Supply Voltage 1.1V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
HTS Code 8542.39.00.01
Min Operating Temperature 0°C
Max Operating Temperature 85°C
Terminal Finish TIN SILVER COPPER
Number of Terminations 896
Pbfree Code yes
JESD-609 Code e1
Published 2013
Physical
Package / Case FBGA
Mount Surface Mount
Supply Chain
Factory Lead Time 12 Weeks
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