5AGXMA3D4F27I3
RoHS
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Package FBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
2009 Non-RoHS Compliant BALL BOTTOM FPGA 100C 1.4MB 670MHz 1.1V
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Technical Details
Supply Chain
Factory Lead Time 12 Weeks
Physical
Mount Surface Mount
Package / Case FBGA
Number of Pins 672
Technical
Published 2009
JESD-609 Code e0
Pbfree Code no
Number of Terminations 672
Terminal Finish TIN LEAD
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.15V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 672
Operating Supply Voltage 1.1V
Supply Voltage-Max (Vsup) 1.18V
Number of I/O 336
RAM Size 1.4MB
Clock Frequency 670MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 156000
Number of Logic Blocks (LABs) 7362
Dimensions
Height Seated (Max) 2.7mm
Length 27mm
Width 27mm
Compliance
RoHS Status Non-RoHS Compliant
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