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Package Three Tower
Category Discrete Semiconductor Products / Diodes - Rectifiers - Arrays
Description Conn Wire to Board HDR 12 POS 3mm Solder ST Thru-Hole Tray
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Technical Details

Technical

Packaging Bulk
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3
Termination Solder
Max Operating Temperature 105°C
Min Operating Temperature -40°C
Gender Male
Pitch 3mm
Terminal Position UPPER
Orientation Straight
Terminal Form UNSPECIFIED
JESD-30 Code R-PUFM-X3
Number of Contacts 12
Number of Elements 2
Contact Resistance 100mOhm
Max Voltage Rating (AC) 250V
Element Configuration Common Cathode
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Schottky
Current - Reverse Leakage @ Vr 1mA @ 80V
Voltage - Forward (Vf) (Max) @ If 840mV @ 250A
Case Connection ISOLATED
Forward Current 500A
Operating Temperature - Junction -55°C~150°C
Application POWER
Max Reverse Voltage (DC) 80V
Average Rectified Current 250A
Number of Phases 1
Peak Reverse Current 1A
Max Repetitive Reverse Voltage (Vrrm) 80V
Diode Configuration 1 Pair Common Cathode

Physical

Diode Element Material SILICON
Package / Case Three Tower
Mounting Type Chassis Mount
Mount Chassis Mount, Through Hole

Supply Chain

Factory Lead Time 7 Weeks

Compliance

RoHS Status RoHS Compliant

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