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RoHS
RoHS RoHS compliant
Package /
Category Prototyping, Fabrication Products / Adapter, Breakout Boards
Description CSP-20/TCSP-20/UCSP-20 TO DIP-20
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Technical Details

Physical

Material FR4 Epoxy Glass
Package Accepted CSP, TCSP, UCSP

Technical

Published 2009
Series Proto-Advantage
Size / Dimension 0.700 x 1.000 17.78mmx25.40mm
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Positions 20
Pitch 0.020 0.50mm
Proto Board Type SMD to DIP

Dimensions

Board Thickness 0.062 1.57mm 1/16

Compliance

RoHS Status ROHS3 Compliant

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