IPC0170
RoHS
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Package /
Category Prototyping, Fabrication Products / Adapter, Breakout Boards
Description
BGA-24 TO DIP-24 SMT ADAPTER (1.
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Inventory: 6967
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Technical Details
Supply Chain
Factory Lead Time 4 Weeks
Physical
Material FR4 Epoxy Glass
Package Accepted BGA
Technical
Published 2015
Series Proto-Advantage
Size / Dimension 1.000Lx1.200W 25.40mmx30.48mm
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Number of Positions 24
Pitch 0.039 1.00mm
Proto Board Type SMD to DIP
Dimensions
Board Thickness 0.063 1.60mm
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