72V263L6BCG8
RoHS
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Package /
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description
BOTTOM COMMERCIAL PARALLEL Copper Silver Tin (Function) FIFO 0C 3.45V 147456bit 6ns
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Technical Details
Supply Chain
Factory Lead Time 7 Weeks
Physical
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Number of Pins 100
Technical
Packaging Tape & Reel
Published 2009
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 100
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
HTS Code 8542.32.00.71
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 100
Operating Supply Voltage 3.3V
Temperature Grade COMMERCIAL
Max Supply Voltage 3.45V
Min Supply Voltage 3.15V
Element Configuration Dual
Operating Mode SYNCHRONOUS
Max Supply Current 35mA
Frequency (Max) 166MHz
Access Time 4 ns
Organization 8KX18
Memory Density 147456 bit
Parallel/Serial PARALLEL
Bus Directional Unidirectional
Retransmit Capability Yes
Output Enable YES
Cycle Time 6 ns
Dimensions
Height Seated (Max) 1.5mm
Length 11mm
Width 11mm
Thickness 1.4mm
Compliance
RoHS Status RoHS Compliant
Lead Free Lead Free
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