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Package BGA
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description Asynchronous Copper Silver Tin 2009 Unidirectional (Function) FIFO 0C 2.625V 4.5Mb 3.4ns
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Technical Details

Compliance

Lead Free Lead Free
RoHS Status RoHS Compliant

Dimensions

Thickness 1.76mm
Width 19mm
Length 19mm

Technical

Retransmit Capability Yes
Bus Directional Unidirectional
Word Size 36b
Sync/Async Asynchronous
Density 4.5 Mb
Access Time 3.4 ns
Frequency (Max) 225MHz
Max Supply Current 90mA
Nominal Supply Current 90mA
Element Configuration Dual
Min Supply Voltage 2.375V
Max Supply Voltage 2.625V
Operating Supply Voltage 2.5V
Min Operating Temperature 0°C
Max Operating Temperature 70°C
Part Status Active
Published 2009
Packaging Bulk

Physical

Number of Pins 240
Package / Case BGA
Mount Surface Mount
Contact Plating Copper, Silver, Tin

Supply Chain

Factory Lead Time 7 Weeks

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