CYW15G0403DXB-BGC
RoHS
/
Package 256-LBGA Exposed Pad
Category Integrated Circuits (ICs) / Interface - Telecom
Description
e0 CY*15G04 Tray HOTlink II? interface telecom 3.135V~3.465V 1.27A 27mm 1500000Mbps
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Technical Details
Physical
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA Exposed Pad
Technical
Packaging Tray
Published 2012
Series HOTlink II?
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn/Pb)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Subcategory Network Interfaces
Technology BICMOS
Voltage - Supply 3.135V~3.465V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number CY*15G04
Pin Count 256
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Power Supplies 3.3V
Temperature Grade COMMERCIAL
Number of Circuits 4
Nominal Supply Current 1.27A
Data Rate 1500000 Mbps
Telecom IC Type TELECOM CIRCUIT
Number of Transceivers 4
Dimensions
Length 27mm
Width 27mm
Compliance
RoHS Status Non-RoHS Compliant
Alternative Model
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