M2S025TS-VF256
RoHS
/
Package 256-LFBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~85C TJ 256KB 166MHz 1.2V
PDF
/
Buying Options
Total Price: USD $136.87
Unit Price: USD $136.868633
≥1 USD $136.868633
≥200 USD $52.967148
≥500 USD $52.967148
≥1000 USD $50.1853
Inventory: 1320
Minimum: 1
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Technical Details
Supply Chain
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Physical
Package / Case 256-LFBGA
Surface Mount YES
Compliance
RoHS Status Non-RoHS Compliant
Dimensions
Width 14mm
Length 14mm
Height Seated (Max) 1.56mm
Technical
Flash Size 256KB
Number of Logic Cells 27696
Primary Attributes FPGA - 25K Logic Modules
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Inputs 138
Architecture MCU, FPGA
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals DDR, PCIe, SERDES
Core Processor ARM? Cortex?-M3
RAM Size 64KB
Speed 166MHz
Number of I/O 138
Supply Voltage-Min (Vsup) 1.14V
Power Supplies 1.2V
Supply Voltage-Max (Vsup) 1.26V
Qualification Status Not Qualified
Number of Outputs 138
JESD-30 Code S-PBGA-B256
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Reach Compliance Code not_compliant
Terminal Pitch 0.8mm
Supply Voltage 1.2V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory Field Programmable Gate Arrays
HTS Code 8542.39.00.01
Additional Feature LG-MIN, WD-MIN
Terminal Finish Tin/Lead (Sn/Pb)
Number of Terminations 256
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
JESD-609 Code e0
Series SmartFusion?2
Published 2015
Packaging Tray
Operating Temperature 0°C~85°C TJ
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