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Package BGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description FIXED POINT MICROPROCESSOR RISC BOTTOM BALL IC Microprocessor 95C 25mm 3.3V 32b
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Technical Details

Physical

Package / Case BGA
Surface Mount YES
Number of Pins 357
Weight 2.096504g

Technical

Packaging Bulk
JESD-609 Code e1
Moisture Sensitivity Level (MSL) 3
Number of Terminations 357
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 95°C
Min Operating Temperature 0°C
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 3.3V
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 357
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.465V
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Frequency (Max) 80MHz
Data Bus Width 32b
Halogen Free Halogen Free
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
Integrated Cache YES
Number of Cores 1

Dimensions

Height Seated (Max) 2.52mm
Length 25mm

Compliance

Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

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