XLF210-256-FB236-C20
RoHS 
RoHS compliant
RoHS compliantPackage 236-LFBGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description
IC MCU 32BIT 2MB FLASH 236FBGA
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Technical Details
Supply Chain
Factory Lead Time 12 Weeks
Physical
Mounting Type Surface Mount
Package / Case 236-LFBGA
Number of Pins 236
Supplier Device Package 236-FBGA (10x10)
Technical
Operating Temperature 0°C~70°C TA
Packaging Tray
Published 2015
Series XLF
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Memory Size 2MB
Oscillator Type External
Number of I/O 128
Speed 2000MIPS
RAM Size 256K x 8
Memory Type FLASH
Voltage - Supply (Vcc/Vdd) 0.95V~3.6V
Core Processor XCore
Program Memory Type FLASH
Core Size 32-Bit 10-Core
Program Memory Size 2MB 2M x 8
Core Architecture XCore
Compliance
RoHS Status ROHS3 Compliant
Alternative Model
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