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XCVU190-3FLGA2577E

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 2577-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description ROHS3Compliant BALL Active BOTTOM field programmable gate array 0C~100C TJ 1V 4.01mm
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Technical Details

Supply Chain

Factory Lead Time 10 Weeks

Physical

Mounting Type Surface Mount
Package / Case 2577-BBGA, FCBGA
Surface Mount YES

Technical

Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Virtex? UltraScale?
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN Code 3A001.A.7.B
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Voltage - Supply 0.970V~1.030V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B2577
Number of I/O 448
Organization 1800 CLBS
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 2349900
Total RAM Bits 150937600
Number of LABs/CLBs 134280
Number of CLBs 1800

Dimensions

Height Seated (Max) 4.01mm
Length 52.5mm
Width 52.5mm

Compliance

RoHS Status ROHS3 Compliant

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