{"id":484,"date":"2025-04-25T21:01:24","date_gmt":"2025-04-25T13:01:24","guid":{"rendered":"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/"},"modified":"2025-04-25T21:01:24","modified_gmt":"2025-04-25T13:01:24","slug":"siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain","status":"publish","type":"post","link":"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/","title":{"rendered":"Siemens Devises Secure Way to Share IC Thermal Models to E-Supply Chain"},"content":{"rendered":"<div class=\"fsc_text\"><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_76 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\r\n<div class=\"ez-toc-title-container\">\r\n<h2 class=\"ez-toc-title\" style=\"cursor:inherit\">Table of Contents<\/h2>\r\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\"><span class=\"ez-toc-js-icon-con\"><span class=\"\"><span class=\"eztoc-hide\" style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #023a85;color:#023a85\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #023a85;color:#023a85\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/span><\/a><\/span><\/div>\r\n<nav><ul class='ez-toc-list ez-toc-list-level-1 ' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#ic_designers_can_now_securely_share_thermal_models_across_the_supply_chain%e2%80%94without_compromising_critical_details_about_chip_architecture\" >IC designers can now securely share thermal models across the supply chain\u2014without compromising critical details about chip architecture.<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#siemens_introduces_embeddable_bci-rom_technology\" >Siemens Introduces Embeddable BCI-ROM Technology<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#bci-rom_boosts_accuracy_security_and_transparency\" >BCI-ROM Boosts Accuracy, Security, and Transparency<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#a_secure_forum_on_thermal_management\" >A Secure Forum on Thermal Management<\/a><\/li><\/ul><\/nav><\/div>\r\n<h2 style=\"text-align: start;\"><span class=\"ez-toc-section\" id=\"ic_designers_can_now_securely_share_thermal_models_across_the_supply_chain%e2%80%94without_compromising_critical_details_about_chip_architecture\"><\/span>IC designers can now securely share thermal models across the supply chain\u2014without compromising critical details about chip architecture.<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p style=\"text-align: start;\">This week, Siemens announced an update to its electronics cooling simulation software that makes IC thermal models more secure and sharable.<\/p>\n<p style=\"text-align: start;\">To avoid the damaging effects of heat generation in high-density chips, IC designers must thoroughly analyze and address heat dissipation. While detailed thermal models can mitigate such damage, these models typically reveal the IC\u2019s internal physical structure. As a result, semiconductor OEMs refrain from sharing this data across the electronic supply chain (&#8220;e-supply chain&#8221;) to protect their intellectual property. <\/p>\n<p style=\"text-align: start;\"><img decoding=\"async\" src=\"https:\/\/file.flywing-tech.com\/res\/article\/2024062409563056309ae281d2f642aa67840e5056d3930af4a21b4.png\" alt=\"\" data-href=\"\" style=\"width: 100%;\"><\/p>\n<h5 style=\"text-align: center;\"><em>IC designers can now share accurate reduced-order thermal models of IC packages for 3D CFD thermal analysis.<\/em><\/h5>\n<p style=\"text-align: start;\">\n<p style=\"text-align: start;\"><\/p>\n<p style=\"text-align: start;\">Siemens claims that its new Embeddable Boundary Condition Independent Reduced Order Model (BCI-ROM) technology, now available in the company&#8217;s <span style=\"color: rgb(255, 122, 69);\">updated Simcenter Flotherm software<\/span>, enables semiconductor companies to create accurate, sharable 3D thermal analysis models that don&#8217;t expose sensitive IP. <\/p>\n<p style=\"text-align: start;\">\n<h2 style=\"text-align: start;\"><span class=\"ez-toc-section\" id=\"siemens_introduces_embeddable_bci-rom_technology\"><\/span>Siemens Introduces Embeddable BCI-ROM Technology<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p style=\"text-align: start;\">Siemens\u2019 Flotherm, a part of the company\u2019s Xcelerator portfolio, is a comprehensive thermal management software for integrated circuit design. By simulating airflow and heat transfer in and around electronic equipment, Flotherm can generate detailed thermal models of electronic systems, enabling engineers to predict thermal performance, optimize design, and prevent overheating.<\/p>\n<p style=\"text-align: start;\"><img decoding=\"async\" src=\"https:\/\/file.flywing-tech.com\/res\/article\/2024062409565656563368647063c946e75e270ba810039f9e2f011.png\" alt=\"\" data-href=\"\" style=\"width: 100%;\"><\/p>\n<h5 style=\"text-align: center;\"><em>Embeddable BCI-ROM (EROM) versus conventional thermal models. <\/em><\/h5>\n<h5 style=\"text-align: center;\"> <\/h5>\n<p style=\"text-align: start;\"><\/p>\n<p style=\"text-align: start;\"><span style=\"color: rgb(255, 122, 69);\">BCI-ROM technology<\/span> creates reduced-order thermal models of IC packages for 3D CFD electronics cooling simulations. Siemens asserts that it also effectively compresses complex thermal models into a simpler form. Independent of specific boundary conditions, the technology enables designers to embed the models in different thermal environments, yielding accurate temperature predictions across various systems.<\/p>\n<p style=\"text-align: start;\">\n<h2 style=\"text-align: start;\"><span class=\"ez-toc-section\" id=\"bci-rom_boosts_accuracy_security_and_transparency\"><\/span>BCI-ROM Boosts Accuracy, Security, and Transparency<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p style=\"text-align: start;\">Flotherm&#8217;s BCI-ROM technology is considered a substantial <a href=\"https:\/\/www.flywing-tech.com\/blog\/using-advanced-spice-models-to-characterize-an-nmos-transistor\/\">advancement over traditional modeling<\/a> methods like the 2-Resistor and DELPHI models. Because BCI-ROM can accurately simulate transient thermal behaviors and manage multiple heat sources in intricate IC packages, engineers can quickly and flexibly iterate thermal solutions.<\/p>\n<p style=\"text-align: start;\"><img decoding=\"async\" src=\"https:\/\/file.flywing-tech.com\/res\/article\/2024062409571857184599c4bf2f604a3ec42ee712c23f311bbc097.png\" alt=\"\" data-href=\"\" style=\"width: 100%;\"><\/p>\n<h5 style=\"text-align: center;\"><em>Workflow of embeddable BCI-ROMs vs. thermal netlists. <\/em><br \/> <\/h5>\n<p style=\"text-align: start;\"><\/p>\n<p style=\"text-align: start;\">Engineering teams can now share high-fidelity thermal simulation data across the electronics supply chain without revealing the IC package&#8217;s internal geometry and material properties. &nbsp;<\/p>\n<h2 style=\"text-align: start;\"><span class=\"ez-toc-section\" id=\"a_secure_forum_on_thermal_management\"><\/span>A Secure Forum on Thermal Management<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p style=\"text-align: start;\">As chips&#8217; power densities continue to increase, IC designers need a secure, collaborative method for sharing <a href=\"https:\/\/www.flywing-tech.com\/blog\/what-are-the-essentials-of-tesla-lvcs-48v-charging-thermal-management-and-maintenance\/\">thermal management<\/a> data. <\/p>\n<p style=\"text-align: start;\">Siemens believes that reduced-order models enable different stakeholders in the electronics supply chain to access vital thermal data for design and testing without the risk of revealing sensitive design details inherent in the full models. This balance of information sharing and IP protection is vital for innovation and efficiency in electronic design and production.<\/p>\n<p style=\"text-align: start;\">\n<hr\/>\n<p><\/p>\n<p style=\"text-align: start;\">\n<p style=\"text-align: start;\"><em>All images used courtesy of Siemens.<\/em><\/p>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>IC designers can now securely share thermal models across the supply chain\u2014without compromising critical details about chip architecture. This week, Siemens announced an update to its electronics cooling simulation software that makes IC thermal models more secure and sharable. To avoid the damaging effects of heat generation in high-density chips, IC designers must thoroughly analyze [&hellip;]<\/p>\n","protected":false},"author":3,"featured_media":198,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[],"class_list":["post-484","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-info"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.3 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\r\n<title>Siemens Devises Secure Way to Share IC Thermal Models to E-Supply Chain - Fly-Wing<\/title>\r\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\r\n<link rel=\"canonical\" href=\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/\" \/>\r\n<meta property=\"og:locale\" content=\"en_US\" \/>\r\n<meta property=\"og:type\" content=\"article\" \/>\r\n<meta property=\"og:title\" content=\"Siemens Devises Secure Way to Share IC Thermal Models to E-Supply Chain - Fly-Wing\" \/>\r\n<meta property=\"og:description\" content=\"IC designers can now securely share thermal models across the supply chain\u2014without compromising critical details about chip architecture. This week, Siemens announced an update to its electronics cooling simulation software that makes IC thermal models more secure and sharable. To avoid the damaging effects of heat generation in high-density chips, IC designers must thoroughly analyze [&hellip;]\" \/>\r\n<meta property=\"og:url\" content=\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/\" \/>\r\n<meta property=\"og:site_name\" content=\"Fly-Wing\" \/>\r\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/profile.php?id=100090565081283\" \/>\r\n<meta property=\"article:published_time\" content=\"2025-04-25T13:01:24+00:00\" \/>\r\n<meta property=\"og:image\" content=\"https:\/\/www.flywing-tech.com\/blog\/wp-content\/uploads\/2025\/04\/202406240957455745a55b25d2f642aa67840e5056d3930af4a21b4.png\" \/>\r\n\t<meta property=\"og:image:width\" content=\"800\" \/>\r\n\t<meta property=\"og:image:height\" content=\"400\" \/>\r\n\t<meta property=\"og:image:type\" content=\"image\/png\" \/>\r\n<meta name=\"author\" content=\"flywing\" \/>\r\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\r\n<meta name=\"twitter:creator\" content=\"@MIKEBigcoolguy\" \/>\r\n<meta name=\"twitter:site\" content=\"@MIKEBigcoolguy\" \/>\r\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"flywing\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\r\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/\"},\"author\":{\"name\":\"flywing\",\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/#\/schema\/person\/aa98d7a110fa8d6510e5a0f6f537ad47\"},\"headline\":\"Siemens Devises Secure Way to Share IC Thermal Models to E-Supply Chain\",\"datePublished\":\"2025-04-25T13:01:24+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/\"},\"wordCount\":450,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/#organization\"},\"image\":{\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.flywing-tech.com\/blog\/wp-content\/uploads\/2025\/04\/202406240957455745a55b25d2f642aa67840e5056d3930af4a21b4.png\",\"articleSection\":[\"Info\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/\",\"url\":\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/\",\"name\":\"Siemens Devises Secure Way to Share IC Thermal Models to E-Supply Chain - Fly-Wing\",\"isPartOf\":{\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.flywing-tech.com\/blog\/wp-content\/uploads\/2025\/04\/202406240957455745a55b25d2f642aa67840e5056d3930af4a21b4.png\",\"datePublished\":\"2025-04-25T13:01:24+00:00\",\"breadcrumb\":{\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#primaryimage\",\"url\":\"https:\/\/www.flywing-tech.com\/blog\/wp-content\/uploads\/2025\/04\/202406240957455745a55b25d2f642aa67840e5056d3930af4a21b4.png\",\"contentUrl\":\"https:\/\/www.flywing-tech.com\/blog\/wp-content\/uploads\/2025\/04\/202406240957455745a55b25d2f642aa67840e5056d3930af4a21b4.png\",\"width\":800,\"height\":400,\"caption\":\"Siemens Devises Secure Way to Share IC Thermal Models to E-Supply Chain\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.flywing-tech.com\/blog\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Info\",\"item\":\"https:\/\/www.flywing-tech.com\/blog\/category\/info\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"Siemens Devises Secure Way to Share IC Thermal Models to E-Supply Chain\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/#website\",\"url\":\"https:\/\/www.flywing-tech.com\/blog\/\",\"name\":\"Fly-Wing\",\"description\":\"Electronic Components Source @Fly-Wing\",\"publisher\":{\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.flywing-tech.com\/blog\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/#organization\",\"name\":\"Fly-wing Technology (HK) Co., Limited\",\"alternateName\":\"Fly-wing Technology\",\"url\":\"https:\/\/www.flywing-tech.com\/blog\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.flywing-tech.com\/blog\/wp-content\/uploads\/2025\/06\/512_512.png\",\"contentUrl\":\"https:\/\/www.flywing-tech.com\/blog\/wp-content\/uploads\/2025\/06\/512_512.png\",\"width\":512,\"height\":512,\"caption\":\"Fly-wing Technology (HK) Co., Limited\"},\"image\":{\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/#\/schema\/logo\/image\/\"},\"sameAs\":[\"https:\/\/www.facebook.com\/profile.php?id=100090565081283\",\"https:\/\/x.com\/MIKEBigcoolguy\"]},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/#\/schema\/person\/aa98d7a110fa8d6510e5a0f6f537ad47\",\"name\":\"flywing\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/www.flywing-tech.com\/blog\/#\/schema\/person\/image\/\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/715c13a9800a2f6db99dd048d31d2ac1fff67d039aa3ed0b3f5b4061ecb7b4cc?s=96&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/715c13a9800a2f6db99dd048d31d2ac1fff67d039aa3ed0b3f5b4061ecb7b4cc?s=96&d=mm&r=g\",\"caption\":\"flywing\"},\"sameAs\":[\"https:\/\/www.flywing-tech.com\/blog\/\"],\"url\":\"https:\/\/www.flywing-tech.com\/blog\/author\/content_manager\/\"}]}<\/script>\r\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Siemens Devises Secure Way to Share IC Thermal Models to E-Supply Chain - Fly-Wing","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/","og_locale":"en_US","og_type":"article","og_title":"Siemens Devises Secure Way to Share IC Thermal Models to E-Supply Chain - Fly-Wing","og_description":"IC designers can now securely share thermal models across the supply chain\u2014without compromising critical details about chip architecture. This week, Siemens announced an update to its electronics cooling simulation software that makes IC thermal models more secure and sharable. To avoid the damaging effects of heat generation in high-density chips, IC designers must thoroughly analyze [&hellip;]","og_url":"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/","og_site_name":"Fly-Wing","article_publisher":"https:\/\/www.facebook.com\/profile.php?id=100090565081283","article_published_time":"2025-04-25T13:01:24+00:00","og_image":[{"width":800,"height":400,"url":"https:\/\/www.flywing-tech.com\/blog\/wp-content\/uploads\/2025\/04\/202406240957455745a55b25d2f642aa67840e5056d3930af4a21b4.png","type":"image\/png"}],"author":"flywing","twitter_card":"summary_large_image","twitter_creator":"@MIKEBigcoolguy","twitter_site":"@MIKEBigcoolguy","twitter_misc":{"Written by":"flywing","Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#article","isPartOf":{"@id":"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/"},"author":{"name":"flywing","@id":"https:\/\/www.flywing-tech.com\/blog\/#\/schema\/person\/aa98d7a110fa8d6510e5a0f6f537ad47"},"headline":"Siemens Devises Secure Way to Share IC Thermal Models to E-Supply Chain","datePublished":"2025-04-25T13:01:24+00:00","mainEntityOfPage":{"@id":"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/"},"wordCount":450,"commentCount":0,"publisher":{"@id":"https:\/\/www.flywing-tech.com\/blog\/#organization"},"image":{"@id":"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#primaryimage"},"thumbnailUrl":"https:\/\/www.flywing-tech.com\/blog\/wp-content\/uploads\/2025\/04\/202406240957455745a55b25d2f642aa67840e5056d3930af4a21b4.png","articleSection":["Info"],"inLanguage":"en-US","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#respond"]}]},{"@type":"WebPage","@id":"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/","url":"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/","name":"Siemens Devises Secure Way to Share IC Thermal Models to E-Supply Chain - Fly-Wing","isPartOf":{"@id":"https:\/\/www.flywing-tech.com\/blog\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#primaryimage"},"image":{"@id":"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#primaryimage"},"thumbnailUrl":"https:\/\/www.flywing-tech.com\/blog\/wp-content\/uploads\/2025\/04\/202406240957455745a55b25d2f642aa67840e5056d3930af4a21b4.png","datePublished":"2025-04-25T13:01:24+00:00","breadcrumb":{"@id":"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#primaryimage","url":"https:\/\/www.flywing-tech.com\/blog\/wp-content\/uploads\/2025\/04\/202406240957455745a55b25d2f642aa67840e5056d3930af4a21b4.png","contentUrl":"https:\/\/www.flywing-tech.com\/blog\/wp-content\/uploads\/2025\/04\/202406240957455745a55b25d2f642aa67840e5056d3930af4a21b4.png","width":800,"height":400,"caption":"Siemens Devises Secure Way to Share IC Thermal Models to E-Supply Chain"},{"@type":"BreadcrumbList","@id":"https:\/\/www.flywing-tech.com\/blog\/siemens-devises-secure-way-to-share-ic-thermal-models-to-e-supply-chain\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.flywing-tech.com\/blog\/"},{"@type":"ListItem","position":2,"name":"Info","item":"https:\/\/www.flywing-tech.com\/blog\/category\/info\/"},{"@type":"ListItem","position":3,"name":"Siemens Devises Secure Way to Share IC Thermal Models to E-Supply Chain"}]},{"@type":"WebSite","@id":"https:\/\/www.flywing-tech.com\/blog\/#website","url":"https:\/\/www.flywing-tech.com\/blog\/","name":"Fly-Wing","description":"Electronic Components Source @Fly-Wing","publisher":{"@id":"https:\/\/www.flywing-tech.com\/blog\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.flywing-tech.com\/blog\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.flywing-tech.com\/blog\/#organization","name":"Fly-wing Technology (HK) Co., Limited","alternateName":"Fly-wing Technology","url":"https:\/\/www.flywing-tech.com\/blog\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.flywing-tech.com\/blog\/#\/schema\/logo\/image\/","url":"https:\/\/www.flywing-tech.com\/blog\/wp-content\/uploads\/2025\/06\/512_512.png","contentUrl":"https:\/\/www.flywing-tech.com\/blog\/wp-content\/uploads\/2025\/06\/512_512.png","width":512,"height":512,"caption":"Fly-wing Technology (HK) Co., Limited"},"image":{"@id":"https:\/\/www.flywing-tech.com\/blog\/#\/schema\/logo\/image\/"},"sameAs":["https:\/\/www.facebook.com\/profile.php?id=100090565081283","https:\/\/x.com\/MIKEBigcoolguy"]},{"@type":"Person","@id":"https:\/\/www.flywing-tech.com\/blog\/#\/schema\/person\/aa98d7a110fa8d6510e5a0f6f537ad47","name":"flywing","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.flywing-tech.com\/blog\/#\/schema\/person\/image\/","url":"https:\/\/secure.gravatar.com\/avatar\/715c13a9800a2f6db99dd048d31d2ac1fff67d039aa3ed0b3f5b4061ecb7b4cc?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/715c13a9800a2f6db99dd048d31d2ac1fff67d039aa3ed0b3f5b4061ecb7b4cc?s=96&d=mm&r=g","caption":"flywing"},"sameAs":["https:\/\/www.flywing-tech.com\/blog\/"],"url":"https:\/\/www.flywing-tech.com\/blog\/author\/content_manager\/"}]}},"_links":{"self":[{"href":"https:\/\/www.flywing-tech.com\/blog\/wp-json\/wp\/v2\/posts\/484","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.flywing-tech.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.flywing-tech.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.flywing-tech.com\/blog\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/www.flywing-tech.com\/blog\/wp-json\/wp\/v2\/comments?post=484"}],"version-history":[{"count":2,"href":"https:\/\/www.flywing-tech.com\/blog\/wp-json\/wp\/v2\/posts\/484\/revisions"}],"predecessor-version":[{"id":2027,"href":"https:\/\/www.flywing-tech.com\/blog\/wp-json\/wp\/v2\/posts\/484\/revisions\/2027"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.flywing-tech.com\/blog\/wp-json\/wp\/v2\/media\/198"}],"wp:attachment":[{"href":"https:\/\/www.flywing-tech.com\/blog\/wp-json\/wp\/v2\/media?parent=484"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.flywing-tech.com\/blog\/wp-json\/wp\/v2\/categories?post=484"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.flywing-tech.com\/blog\/wp-json\/wp\/v2\/tags?post=484"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}